Wiring substrate and method of manufacturing the same

ABSTRACT

A wiring substrate includes an insulating layer, a connection pad buried in the insulating layer in a state that an upper surface of the connection pad is exposed from an upper surface of the insulating layer and a lower surface and at least a part of a side surface of the connection pad contact the insulating layer, and a concave level difference portion formed in the insulating layer around an outer periphery part of the connection pad, wherein an upper surface of the connection pad and an upper surface of the insulating layer are arranged at a same height.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority of theprior Japanese Patent Application No. 2011-210212, filed on Sep. 27,2011, the entire contents of which are incorporated herein by reference.

FIELD

It is related to a wiring substrate on which a semiconductor chip, orthe like is mounted, and a method of manufacturing the same.

BACKGROUND

In the prior art, there is a method in which a wiring substrate isobtained by forming a multilayer wiring including connection pads on asupporting plate, and removing the supporting plate to expose theconnection pads. Such wiring substrate is manufactured in many cases ina state that surfaces of the connection pads and a surface of aninsulating layer constitute the same plane.

As a result, there is such a risk that, in the situation that a pitch ofthe connection pads of the wiring substrate is made narrower, when asemiconductor chip is flip-chip connected to the connection pads by thesolder, the solder flows from the connection pad to the lateraldirection to cause an electric short-circuit between the connectionpads.

Also, the surface of the wiring substrate on the connection pad side ismade flat. Therefore, the accuracy of image recognition of fiducialmarks provided on the surface of the wiring substrate on the connectionpad side is bad. As a result, it becomes difficult to align and mountthe semiconductor chip, or the like with high precision.

A related art is disclosed in International Publication Pamphlet No. WO2008-001915.

SUMMARY

According to one aspect discussed herein, there is provided a wiringsubstrate, which includes an insulating layer, a connection pad buriedin the insulating layer in a state that an upper surface of theconnection pad is exposed from an upper surface of the insulating layerand a lower surface and at least a part of a side surface of theconnection pad contact the insulating layer, and a concave leveldifference portion formed in the insulating layer around an outerperiphery part of the connection pad.

Also, according to another aspect discussed herein, there is provided amethod of manufacturing a wiring substrate, which includes forming aresist in which an opening portion is provided, on a supporting plate,forming a concave portion in the supporting plate through the openingportion of the resist, forming a metal layer for a connection pad in theconcave portion of the supporting plate and the opening portion of theresist, by an electroplating utilizing the supporting plate as a platingpower feeding path, removing the resist, forming a ring-like part of thesupporting plate around an outer periphery part of the metal layer as aconvex level difference portion whose height is higher than other etchedsurfaces, by etching the supporting plate, forming an insulating layercovering the metal layer, on the supporting plate, and exposing themetal layer by removing the supporting plate.

Also, according to still another aspect discussed herein, there isprovided a method of manufacturing a wiring substrate, which includesforming a resist in which an opening portion is provided, on asupporting plate, forming a laminated metal layer by forming a sacrificemetal layer and a metal layer for a connection pad sequentially on thesupporting plate in the opening portion of the resist, by anelectroplating utilizing the supporting plate as a plating power feedingpath, removing the resist, forming a ring-like part of the supportingplate around an outer periphery part of the laminated metal layer as aconvex level difference portion whose height is higher than other etchedsurfaces, by etching the supporting plate, forming an insulating layercovering the laminated metal layer, on the supporting plate, andexposing the metal layer for the connection pad, by removing thesupporting plate and the sacrifice metal layer.

The object and advantages of the invention will be realized and attainedby means of the elements and combination particularly pointed out in theclaims.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and arenot restrictive of the invention, as claimed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1E are sectional views (#1) depicting a method ofmanufacturing a wiring substrate according to a first embodiment;

FIGS. 2A to 2D are sectional views (#2) depicting the method ofmanufacturing the wiring substrate according to the first embodiment;

FIG. 3 is a sectional view and a fragmental plan view depicting a wiringsubstrate according to the first embodiment;

FIG. 4 is a sectional view (#1) depicting a state that the semiconductorchip is flip-chip connected to the wiring substrate in FIG. 3;

FIG. 5 is a sectional view (#2) depicting a state that the semiconductorchip is flip-chip connected to the wiring substrate in FIG. 3;

FIG. 6 is a sectional view depicting a state that the semiconductor chipis flip-chip connected to the wiring substrate in FIG. 3, according toanother mode;

FIGS. 7A to 7D are sectional views (#1) depicting a method ofmanufacturing a wiring substrate according to a second embodiment;

FIGS. 8A to 8D are sectional views (#2) depicting the method ofmanufacturing the wiring substrate according to the second embodiment;

FIG. 9 is a sectional view depicting a wiring substrate according to thesecond embodiment;

FIG. 10 is a sectional view depicting another wiring substrate accordingto the second embodiment;

FIGS. 11A to 11D are sectional views (#1) depicting a method ofmanufacturing a wiring substrate according to a third embodiment;

FIGS. 12A and 12B are sectional views (#2) depicting the method ofmanufacturing the wiring substrate according to the third embodiment;

FIG. 13 is a sectional view depicting a wiring substrate according tothe third embodiment;

FIG. 14 is a sectional view depicting another wiring substrate accordingto the third embodiment;

FIG. 15 is a sectional view (#1) depicting a state that thesemiconductor chip is flip-chip connected to the wiring substrate inFIG. 13; and

FIG. 16 is a sectional view (#2) depicting a state that thesemiconductor chip is flip-chip connected to the wiring substrate inFIG. 13.

DESCRIPTION OF EMBODIMENTS

Embodiments will be explained with reference to the accompanyingdrawings hereinafter.

(First Embodiment)

FIG. 1A to FIG. 2D are sectional views depicting a method ofmanufacturing a wiring substrate according to a first embodiment, andFIG. 3 are views depicting a wiring substrate according to the firstembodiment.

In the method of manufacturing the wiring substrate according to thefirst embodiment, as depicted in FIG. 1A, first, a supporting plate 10made of copper (Cu) is prepared as a temporary substrate. As thesupporting plate 10, a metal plate or a metallic foil is used, and acopper foil is used as an example. Then, the surface of the supportingplate 10 is made uneven by the roughening process, and thus a roughenedsurface S is obtained.

Then, as depicted in FIG. 1B, a dry film resist 12 is pasted onto theroughened surface S of the supporting plate 10, and then an openingportion 12 a is formed in the dry film resist 12 by using thephotolithography. The opening portion 12 a is formed in the dry filmresist 12 like a circular shape when viewed from the top.

At this time, the dry film resist 12 is formed on the roughened surfaceS of the supporting plate 10. Therefore, this dry film resist 12 can beformed with good adhesion to the supporting plate 10.

Here, a liquid resist may be used instead of the dry film resist 12.

Then, as depicted in FIG. 1C, a concave portion 10 a is formed byperforming the wet etching to the supporting plate 10 through theopening portion 12 a of the dry film resist 12. Since the concaveportion 10 a of the supporting plate 10 is formed by the isotropicetching, the concave portion 10 a is formed with a size that is largerthan the opening portion 12 a of the dry film resist 12. A depth of theconcave portion 10 a is set in the range from 1 μm to 5 μm, for example.

Then, as depicted in FIG. 1D, a nickel (Ni) layer 20 a (barrier metallayer) is formed on the concave portion 10 a of the supporting plate 10in the opening portion 12 a of the dry film resist 12 by theelectroplating utilizing the supporting plate 10 as a plating powerfeeding path.

In the example in FIG. 1D, the nickel layer 20 a is filled in the wholeof the concave portion 10 a of the supporting plate 10. In this case,this nickel layer 20 a may be formed until the halfway position of thedepth of the concave portion 10 a, or may be formed until the halfwayposition of the depth of the opening portion 12 a of the dry film resist12.

In the step of forming the nickel layer 20 a, the bottom surface of theconcave portion 10 a of the supporting plate 10 is formed as a smoothsurface by the etching process. Therefore, even when the nickel layer 20a is formed with thin film, the nickel layer 20 a can be formed to coversatisfactorily the bottom surface of the concave portion 10 a.

Then, as depicted in FIG. 1E, a copper layer 20 b is formed on thenickel layer 20 a in the opening portion 12 a of the dry film resist 12by the similar electroplating.

In this manner, metal layers for the connection pad are formed in theconcave portion 10 a of the supporting plate 10 and the opening portion12 a of the dry film resist 12.

Subsequently, as depicted in FIG. 2A, the dry film resist 12 is removed.In the first embodiment, a connection pad P is formed of the nickellayer 20 a (barrier metal layer) and the copper layer 20 b. Theconnection pad P is formed as a first wiring layer. The connection pad Pmay be formed to be isolated like an island shape, or may be arrangedsuch that this connection pad P is connected to one end of the leadingwiring layer which is extended.

Then, as depicted in FIG. 2B, a roughening process liquid is sprayedonto a structural body in FIG. 2A from a nozzle (not shown) of the sprayequipment. Therefore, the surface of the copper layer 20 b of theconnection pad P is etched, and thus the roughened surface S is formed.

At this time, the surface of the supporting plate 10 (copper) is alsoetched, and the roughened surface S is still maintained. As theroughening process liquid, a liquid that the additive agent formed of acompound such as imidazole, triazole, amine, or the like, which forms acomplex together with copper, is contained in a formic acid or an aceticacid, is used.

In the wet etching executed by using this roughening process liquid,there is such a tendency that the roughening process liquid is notsufficiently supplied to an outer periphery part A (foot part) of theconvex connection pad P having the convex shape. Consequently, in thering-like part of the supporting plate 10 (copper) as the outerperiphery part A of the connection pad P, an amount of etching executedby the roughening process liquid is considerably smaller than otherareas.

As a result, the ring-like part of the supporting plate 10 (copper) asthe outer periphery part A of the connection pad P constitutes a convexlevel difference portion 10 y whose height is higher than other etchedsurface 10 x. A width W of the convex level difference portion 10 yformed around the connection pad P is set in the range from 2 μm to 5μm, for example. Also, an amount of etching (depth) d of the supportingplate 10 (copper) executed by the roughening process liquid is set inthe range from 1 μm to 5 μm, for example.

In the first embodiment, the supporting plate 10 is etched such that theetched surface 10 x of the supporting plate 10 is positioned at the sameheight as a lower surface of the nickel layer 20 a.

Here, in addition to the method using the spray equipment, the similaretching results to the above can be obtained by the method in which awork is dipped in a treatment tab, and is wet-etched, or the like.

Then, as depicted in FIG. 2C, a first interlayer insulating layer 30 isformed on the supporting plate 10 and the connection pad P. Then, thefirst interlayer insulating layer 30 is processed by the laser, therebya first via hole VH1 reaching the connection pad P is formed. The firstinterlayer insulating layer 30 is formed by pasting a resin sheet madeof an epoxy resin, a polyimide resin, or the like.

Since the surfaces of the connection pad P and the supporting plate 10are formed as the roughened surface S, the first interlayer insulatinglayer 30 is formed on them with good adhesion.

Otherwise, a photosensitive resin may be used as the first interlayerinsulating layer 30, and then the first via hole VH1 may be formed bythe photolithography. Also, in addition to the pasting of the resinsheet, a liquid resin may be coated.

Then, a second wiring layer 22 connected to the connection pad P via thefirst via hole VH1 (via conductor) is formed on the first interlayerinsulating layer 30. The second wiring layer 22 is formed by thesemi-additive process, for example.

To explain in detail, first, a seed layer (not shown) made of copper, orthe like is formed on the first interlayer insulating layer 30 and aninner surface of the first via hole VH1 by the electroless plating orthe sputter method. Then, a plating resist (not shown) in which anopening portion is provided on the part where the second wiring layer 22is arranged, is formed on the seed layer.

Then, a metal plating layer made of copper, or the like is formed froman inner part of the first via hole VH1 to the opening portion of theplating resist by the electroplating utilizing the seed layer as aplating power feeding path. Then, the plating resist is removed, andthen the seed layer is etched while using the metal plating layer as amask. By this matter, the second wiring layer 22 is formed of the seedlayer and the metal plating layer.

Then, by repeating the similar steps, a second interlayer insulatinglayer 32, in which a second via hole VH2 reaching the second wiringlayer 22 is provided, is formed on the first interlayer insulating layer30. Subsequently, by repeating the similar steps, a third wiring layer24, which is connected to the second wiring layer 22 via the second viahole VH2 (via conductor), is formed on the second interlayer insulatinglayer 32.

Then, a protection insulating layer 34, in which an opening portion 34 ais provided on the connection part of the third wiring layer 24, isformed. As the protection insulating layer 34, a solder resist, or thelike is used. Then, as the need arises, a contact layer is formed on theconnection part of the third wiring layer 24 by forming nickel/goldplating layers in sequence from the bottom, or the like.

Then, as depicted in FIG. 2D, the supporting plate 10 (copper) isremoved by the wet etching using an etchant such as an alkaline aqueoussolution, or the like. At this time, the nickel layer 20 a (barriermetal layer) of the connection pad P and the first interlayer insulatinglayer 30 (resin) function as an etching stop layer when the supportingplate 10 (copper) is etched, and thus the etching is stopped.

In the case that the copper is exposed from the surface of the thirdwiring layer 24, the supporting plate 10 (copper) is etched in a statethat the third wiring layer 24 is protected with a protection sheet.

At this time, the convex level difference portion 10 y of the supportingplate 10, which is obtained in the above step in FIG. 2B, is also etchedand thus removed. Therefore, a concave level difference portion C isformed in the first interlayer insulating layer 32 located in the outerperiphery part of the nickel layer 20 a of the connection pad P 30 in astate that the concave level difference portion C is connected like ringshape. With the above, a wiring substrate 1 of the first embodiment isobtained.

In this case, when the large-size supporting plate 10 available for themulti production is employed, a wiring member in FIG. 2D is cut suchthat individual wiring substrates can be obtained.

In the present embodiment, the supporting plate 10 is formed of copper,and also the nickel layer 20 a is formed as the barrier metal layer inthe undermost position of the connection pad P. Therefore, thesupporting plate 10 (copper) can be removed selectively with respect tothe connection pad P.

Except the combination of copper and nickel, the barrier metal layer ofthe connection pad P may be formed of various metals, which aredifferent from the supporting plate 10, so as to have the resistancewhen the supporting plate 10 is wet-etched.

For example, in the case that the supporting plate 10 is formed of thecopper, in addition to nickel (Ni) as the barrier metal layer of theconnection pad P, gold (Au), palladium (Pd), silver (Ag), or the likecan be used.

In FIG. 3, the state that the wiring substrate 1 in FIG. 2D is reversedup and down is depicted. As depicted in FIG. 3, in the wiring substrate1 of the first embodiment, the connection pad P is buried in the firstinterlayer insulating layer 30 as the first wiring layer in a state thatthe upper surface of the connection pad P is exposed from the firstinterlayer insulating layer 30.

In the example of the first embodiment, the connection pad P is formedof the copper layer 20 b and the nickel layer 20 a (barrier metal layer)formed on the copper layer 20 b. A diameter of the nickel layer 20 a isset larger than a diameter of the copper layer 20 b, and such asituation is obtained that the nickel layer 20 a protrudes outward fromthe outer peripheral edge of the copper layer 20 b.

In this manner, the connection pad P includes a lower layer part and anupper layer part whose diameter is larger than that of the lower layerpart. An example of the lower layer part of the connection pad Pcorresponds to the copper layer 20 b, and an example of the upper layerpart corresponds to the nickel layer 20 a. An outer peripheral edge ofthe lower layer part (copper layer 20 b) of the connection pad Pretrogresses toward a center of the connection pad P from an outerperipheral edge of the upper layer part (nickel layer 20 a).

As an example of a planar shape of the connection pad P, the connectionpad P is formed like a circular shape. In this case, a diameter of theconnection pad P is set in the range from 20 μm to 150 μm. In this mode,a retrogressing width that the outer peripheral edge of the lower layerpart (copper layer 20 b) of the connection pad P retrogresses toward thecenter of the connection pad P from the outer peripheral edge of theupper layer part (nickel layer 20 a), is about from 0.5 μm to 5 μm.

Here, as a planar shape of the connection pad P, any planar shape suchas a rectangular shape, a polygonal shape, or the like other than thecircular shape may be used.

As described above, in the present embodiment, the method in which theconnection pad P is exposed by removing the supporting plate 10 afterthe multilayer wiring including the connection pads P is formed on thesupporting plate 10, is employed. As a result, both the upper surface ofthe connection pad P and the upper surface of the first interlayerinsulating layer 30 in the wiring substrate 1 are arranged at the sameheight.

The nickel layer 20 a is illustrated as the barrier metal layer of theconnection pad P. In this case, the barrier metal layer may be formed ofeither a single metal layer selected from a group consisting of gold(Au), palladium (Pd), nickel (Ni), copper (Cu), and silver (Ag) or alaminated metal film including two metals or more.

Preferably, a laminated film formed of gold layer/nickel layer from thetop, a laminated film formed of gold layer/palladium layer/nickel layerfrom the top, a laminated film formed of gold layer/silverlayer/palladium layer/nickel layer from the top, a single layer filmformed of a silver layer, a laminated film formed of silver layer/nickellayer from the top, a laminated film formed of silver layer/palladiumlayer/nickel layer from the top, or the like can be used in the state inFIG. 3. Namely, the gold layer or the silver layer is formed as a layerexposed to the outside.

In the above step in FIG. 1D, any plating metal layer may be formed soas to obtain a desired barrier metal layer in place of the nickel layer20 a.

In the example in FIG. 3, the lower surface of the connection pad P andthe whole side surface of the lower layer part (copper layer 20 b)contact the first interlayer insulating layer 30 and are buried in it,and the side surface of the upper layer part (nickel layer 20 a) isexposed. In this case, at least a part of the side surface of theconnection pad P may contact the first interlayer insulating layer 30and is buried in it.

By reference to a fragmental plan view in FIG. 3 together, the concavelevel difference portion C is formed in the ring-like part on the firstinterlayer insulating layer 30 as the outer periphery part of the nickellayer 20 a of the connection pad P. The concave level difference portionC is provided to contact the outer peripheral edge of the upper layerpart (nickel layer 20 a) of the connection pad P. Also, the concavelevel difference portion C is formed from the upper surface of the firstinterlayer insulating layer 30 to the position corresponding to thelower surface of the nickel layer 20 a (upper layer part).

In this manner, in the wiring substrate 1 of the first embodiment, thelower surface and the side surface of the copper layer 20 b of theconnection pad P are buried in the first interlayer insulating layer 30,and the concave level difference portion C is formed in the firstinterlayer insulating layer 30 around the outer periphery part of thenickel layer 20 a of the connection pad P. By this matter, the uppersurface and the side surface of the nickel layer 20 a of the connectionpad P are exposed from the first interlayer insulating layer 30.

Further, in the first interlayer insulating layer 30, the first via holeVH1 reaching the connection pad P from its lower surface side isprovided. Then, the second wiring layer 22 connected to the connectionpad P via the first via hole VH1 (via conductor) is formed on the lowersurface of the first interlayer insulating layer 30.

Similarly, the second interlayer insulating layer 32, in which thesecond via hole VH2 reaching the second wiring layer 22 is provided, isalso formed on the lower surface of the first interlayer insulatinglayer 30. Similarly, the third wiring layer 24 connected to the secondwiring layer 22 via the second via hole VH2 (via conductor) is alsoformed on the lower surface of the second interlayer insulating layer32. Also, the protection insulating layer 34, in which the openingportion 34 a is provided on the connection part of the third wiringlayer 24, is formed on the lower surface of the second interlayerinsulating layer 32.

In the example in FIG. 3, the two-layer build-up wiring layer connectedto the connection pad P is formed on the lower side of the firstinterlayer insulating layer 30. In this case, the number of layers inthe build-up wiring layer can be set arbitrarily to n layers (n is aninteger of 1 or more). This is similar in the second and thirdembodiments.

As depicted in FIG. 3, the via holes VH1, VH2 of the wiring substrate 1of the first embodiment are formed respectively in such a manner that asectional shape is formed like a frustum of circular cone, whose bottomsurface is arranged to the connection pad side and which is openedtoward the formation surface side of the external connection terminals,and in which a diameter on the bottom surface side is set smaller than adiameter on the opening side.

The wiring substrate 1 of the present embodiment can be manufactured asa coreless substrate which does not have a core substrate whosethickness is thick, and can also be used as the mounting substrateavailable for a high-performance semiconductor chip.

In FIG. 4 and FIG. 5, a state that a semiconductor chip is flip-chipconnected to the wiring substrate 1 of the present embodiment isdepicted.

As depicted in FIG. 4, flux (not shown) is coated on the connection padsP of the wiring substrate 1 in FIG. 3, and then a solder material 26such as a solder paste, or the like is coated on the connection pads P.Then, a semiconductor chip 40 including solder dumps 42 is prepared, andthen the solder dumps 42 of the semiconductor chip 40 are arranged onthe solder materials 26 on the connection pads P of the wiring substrate1.

Then, as depicted in FIG. 5, the semiconductor chip 40 is flip-chipconnected to the connection pads P of the wiring substrate 1 by a solderelectrode 44 by performing the reflow heating. An underfill resin may befilled in a clearance between the lower side of the semiconductor chip40 and the upper surface of the wiring substrate 1.

Then, before or after the semiconductor chip is mounted, an externalconnection terminal 28 is provided by mounting a solder ball on theconnection parts of the third wiring layers 24, or the like.

In the wiring substrate 1 of the first embodiment, the concave leveldifference portion C is formed in the first interlayer insulating layer30 around the outer periphery part of connection pad P such that itsurrounds the connection pad P.

Therefore, when the semiconductor chip 40 is flip-chip connected, thesolder is dammed up by the concave level difference portion C formedaround the connection pad P, and it can be prevented that the extrasolder flows to the adjacent connection pad P to cause an electricshort-circuit.

Also, fiducial marks having a structure in which the concave leveldifference portion C is formed in the first interlayer insulating layer30 around the connection pads P can be formed simultaneously. Thefiducial marks are formed by the similar method to the connection pads Pat the time of forming the connection pads P, and become the similarstructure to the connection pads P.

At this time, unlike the present embodiment, in the case that theconcave level difference portion C is not formed around the connectionpad P, particularly when both surface roughness of the connection pads Pand the first interlayer insulating layer 30 are equal each other, it isdifficult to clearly recognize the images of the fiducial marks.

However, in the present embodiment, irrespective of the surfaceroughness of the connection pads P and the first interlayer insulatinglayer 30, the images of the fiducial marks can be clearly recognized bythe concave level difference portions C provided around the connectionpads P. By this matter, even though the semiconductor chip 40 whichincludes connection electrodes having a narrow pitch of 100 μm or lessis used, such semiconductor chip can be aligned with the wiringsubstrate 1 with high precision and can be mounted thereon.

Otherwise, as depicted in FIG. 6, on the contrary to FIG. 5, the wiringsubstrate 1 in FIG. 3 may be reversed up and down, and then thesemiconductor chip 40 may be flip-chip connected to the connection partsof the third wiring layers 24 via the solder electrodes 44. Then, theexternal connection terminals 28 are provided by mounting the solderball on the connection pads P, or the like. In the case of this mode, adiameter of the connection pad P is set in the range from 150 μm to 1000μm.

Also, a difference of diameter between the upper layer part and thelower layer part of the connection pad P becomes 1 to 10 μm.

(Second Embodiment)

FIGS. 7A to 7D and FIGS. 8A to 8D are sectional views depicting a methodof manufacturing a wiring substrate according to a second embodiment,and FIG. 9 and FIG. 10 are sectional views depicting a wiring substrateaccording to the second embodiment. In the second embodiment, detailedexplanation of the same steps and the same elements as those in thefirst embodiment will be omitted hereunder.

In the above first embodiment, the connection pad P is formed of thecopper layer 20 b and the barrier metal layer (nickel layer 20 a, or thelike) formed thereon. In this second embodiment, the connection pad isformed of a single copper layer or the antioxidant (OSP) is formed on asurface of the copper layer.

In the method of manufacturing the wiring substrate according to thesecond embodiment, as depicted in FIG. 7A, like FIG. 1A to FIG. 3 of thefirst embodiment, the dry film resist 12 in which the opening portion 12a is provided is patterned on the roughened surface S of the supportingplate 10 made of copper. Then, the concave portion 10 a is formed byetching the supporting plate 10 in the opening portion 12 a of the dryfilm resist 12.

Then, as depicted in FIG. 7B, the nickel layer 20 a (barrier metallayer) is formed on the concave portion 10 a of the supporting plate 10in the opening portion 12 a of the dry film resist 12 by theelectroplating utilizing the supporting plate 10 as a plating powerfeeding path. In the second embodiment, the nickel layer 20 a is formeduntil the halfway position of the depth of the concave portion 10 a ofthe supporting plate 10.

Then, as depicted in FIG. 7C, the copper layer 20 b which is connectedto the nickel layer 20 a is formed from the remaining space of theconcave portion 10 a of the supporting plate 10 to the opening portion12 a of the dry film resist 12 by the similar electroplating. In thismanner, the metal layers for the connection pad are formed in theconcave portion 10 a of the supporting plate 10 and the opening portion12 a of the dry film resist 12.

Then, as depicted in FIG. 7D, the dry film resist 12 is removed.

In the second embodiment, the copper layer 20 b functions as theconnection pad P, and the nickel layer 20 a (barrier metal layer) formedunder the copper layer 20 b functions as an etching stop layer when thesupporting plate 10 is etched. Then, this nickel layer 20 a is removedfinally.

Subsequently, as depicted in FIG. 8A, like the first embodiment, theroughening process liquid is sprayed onto a structural body in FIG. 7Dby using a spray equipment (not shown). Thereby, the copper layer 20 bof the connection pad P and the supporting plate 10 (copper) are etched,and thus the roughened surface S is obtained.

At this time, like the step in FIG. 2B of the first embodiment, thering-like part of the supporting plate 10 around the outer peripherypart A of the connection pad P is formed as the convex level differenceportion 10 y whose height is higher than the etched surface 10 x.

In the second embodiment, the supporting plate 10 is etched such thatthe etched surface 10 x of the supporting plate 10 is set to the sameheight as the lower surface of the copper layer 20 b (connection pad P).

Then, as depicted in FIG. 8B, as in FIG. 2C of the first embodiment, thetwo-layer build-up wiring layer (the second and third wiring layers 22,24, the first and second interlayer insulating layers 30, 32, and theprotection insulating layer 34) connected to the connection pad P isformed.

Then, as depicted in FIG. 8C, as in FIG. 2D of the first embodiment, thesupporting plate 10 is removed by the wet etching using an alkalineaqueous solution. At this time, the nickel layer 20 a (barrier metallayer) and the first interlayer insulating layer 30 (resin), which areformed under the connection pad P, function as an etching stop layerwhen the supporting plate 10 is etched.

Like the first embodiment, except the combination of copper and nickel,the barrier metal layer of the connection pad P may be formed of variousmetals, which are different from the supporting plate 10, so as to havethe resistance when the supporting plate 10 is wet-etched.

Then, as depicted in FIG. 8D, the nickel layer 20 a exposed from thelower surface of the connection pad P is removed by performing the wetetching selectively to the connection pad P (copper). As the etchant ofthe nickel layer 20 a, nitric acid hydrogen peroxide mixture (a mixedsolution of nitric acid and hydrogen peroxide (HNO₃/H₂O₂)) is used. Bythis matter, the concave level difference portion C is obtained in thefirst interlayer insulating layer 30 around the outer peripheral part ofthe connection pad P which is exposed.

With the above, a wiring substrate 2 according to the second embodimentis obtained. Here, in case the large-size supporting plate 10 availablefor the multi production is used, the wiring member in FIG. 8D is cutsuch that individual wiring substrates can be obtained.

In FIG. 9, the state that the wiring substrate 2 in FIG. 8D is reversedup and down is depicted. As depicted in FIG. 9, in the wiring substrate2 of the second embodiment, the whole of the connection pad P is formedof the copper layer 20 b. The connection pad P is formed of a lowerlayer part P1, and an upper layer part P2 whose diameter is set largerthan a diameter of the lower layer part P1. A lower surface and a sidesurface of the lower layer part P1 of the connection pad P are buried inthe first interlayer insulating layer 30.

Then, like the first embodiment, the concave level difference portion Cis formed in the first interlayer insulating layer 30 around the outerperiphery part of the upper layer part P2 of the connection pad P. Theconcave level difference portion C is formed from the upper surface ofthe first interlayer insulating layer 30 to the position correspondingto the lower surface of the upper layer part P2 of the connection pad P.

By this matter, an upper surface and a side surface of the upper layerpart P2 of the connection pad P are exposed from the first interlayerinsulating layer 30. The concave level difference portion C is providedto contact an outer peripheral edge of the upper layer part P2 of theconnection pad P.

Then, like the first embodiment, the two-layer build-up wiring layer(the second and third wiring layers 22, 24, the first and secondinterlayer insulating layers 30, 32, and the protection insulating layer34) connected to the connection pad P is formed to the lower surfaceside of the first interlayer insulating layer 30.

Then, like the wiring substrate 1 in FIG. 4 and FIG. 5 of the firstembodiment, the semiconductor chip 40 is flip-chip connected to theconnection pads P of the wiring substrate 2. Otherwise, like FIG. 6 ofthe first embodiment, the semiconductor chip 40 may be flip-chipconnected to the connection parts of the third wiring layer 24, and thenthe external connection terminal 28 may be provided to the connectionpads P.

Like a wiring substrate 2 a depicted in FIG. 10, an antioxidant 23 (OSP(Organic Solder Passivation)) may be formed as a surface treatment layeron the copper layer 20 b of the wiring substrate 2 in FIG. 9 toconstitute the connection pad P.

The antioxidant is formed of an imidazole compound, or the like, andprevents the oxidation of the contact surface (copper) of the connectionpad P. This antioxidant disappears when the solder bumps of thesemiconductor chip are mounted onto the connection pads P by performingthe reflow heating, or the like.

The wiring substrates 2, 2 a of the second embodiment can achieve thesimilar advantages to those of the wiring substrate 1 of the firstembodiment.

(Third Embodiment)

FIGS. 11A to 11D and FIGS. 12A and 12B are sectional views depicting amethod of manufacturing a wiring substrate according to a thirdembodiment, and FIG. 13 and FIG. 14 are sectional views depicting awiring substrate according to the third embodiment. In this thirdembodiment, detailed explanation of the same steps and the same elementsas those in the first embodiment will be omitted herein.

In the wiring substrate of the third embodiment, the connection pad isarranged to the bottom portion side of the concave portion on the firstinterlayer insulating layer, and then the concave level differenceportion is provided in the first interlayer insulating layer around theupper outer periphery part of the concave portion.

In the method of manufacturing the wiring substrate according to thethird embodiment, as depicted in FIG. 11A, like FIGS. 1A and 1B of thefirst embodiment, the dry film resist 12 in which the opening portion 12a is provided is patterned on the roughened surface S of the supportingplate 10 made of copper. In the third embodiment, the step of formingthe concave portion in the supporting plate 10 is omitted herein.

Then, as depicted in FIG. 11B, a first copper layer 21 a (sacrificemetal layer), a nickel layer 21 b (barrier metal layer), and a secondcopper layer 21 c are formed sequentially on the supporting plate 10 inthe opening portion 12 a of the dry film resist 12 by the electroplatingutilizing the supporting plate 10 as a plating power feed path.

In the third embodiment, the connection pad P is formed of the nickellayer 21 b (barrier metal layer) and the second copper layer 21 c. Thefirst copper layer 21 a which is the undermost layer is formed as thesacrifice metal layer for obtaining a concave portion, and is removedfinally. In this manner, a laminated metal layer is obtained by formingsequentially the sacrifice metal layer and the metal layer for theconnection pad on the supporting plate 10 in the opening portion 12 a ofthe dry film resist 12.

Then, as depicted in FIG. 11C, the dry film resist 12 is removed.

Then, as depicted in FIG. 11D, like the first embodiment, the rougheningprocess liquid is sprayed onto a structural body in FIG. 11C by a sprayequipment (not shown). Thereby, the surface of the connection pad P andthe supporting plate 10 (copper) are etched, and thus the roughenedsurface S is obtained.

At this time, the ring-like part of the supporting plate 10 around theouter periphery part A of the connection pad P is formed as the convexlevel difference portion 10 y whose height is higher than the otheretched surface 10 x.

Subsequently, as depicted in FIG. 12A, like FIG. 2C of the firstembodiment, the two-layer build-up wiring layer (the second and thirdwiring layers 22, 24, the first and second interlayer insulating layers30, 32, and the protection insulating layer 34) connected to theconnection pad P is formed.

Then, as depicted in FIG. 12B, like FIG. 2D of the first embodiment, thesupporting plate 10 (copper) is removed by performing the wet etchingusing an alkaline aqueous solution. At this time, the first copper layer21 a (sacrifice metal layer) formed under the connection pad P is etchedsequentially and removed. By this matter, a concave portion 30 a isprovided in the first interlayer insulating layer 30 under theconnection pad P, and also the concave level difference portion C isobtained in the outer periphery part of the concave portion 30 a.

In the third embodiment, the supporting plate 10 and the sacrifice metallayer (first copper layer 21 a) are formed of copper, and the barriermetal layer (nickel layer 21 b) is formed as the lowermost layer of theconnection pad P. Therefore, the supporting plate 10 and the sacrificemetal layer (first copper layer 21 a) are removed selectively withrespect to the connection pad P.

Like the first embodiment, except the combination of the copper and thenickel, the barrier metal layer of the connection pad P may be formed ofvarious metals, which are different from the supporting plate 10 and thesacrifice metal layer, so as to have the resistance when the supportingplate 10 and the sacrifice metal layer are wet-etched.

With the above, a wiring substrate 3 of the third embodiment isobtained. Here, in case the large-size supporting plate 10 available forthe multi production is used, a wiring member in FIG. 12B is cut suchthat individual wiring substrates can be obtained.

In FIG. 13, the state that the wiring substrate 3 in FIG. 12B isreversed up and down is depicted. In the wiring substrate 3 of the thirdembodiment, the connection pad P is formed of the second copper layer 21c and the nickel layer 21 b (barrier metal layer) formed on the secondcopper layer 21 c, and is formed to have the same diameter over thewhole connection pad.

Like the first embodiment, the nickel layer 21 b is illustrated as thebarrier metal layer of the connection pad P. However, the barrier metallayer may be formed of either a single metal layer selected from a groupconsisting of gold (Au), palladium (Pd), nickel (Ni), copper (Cu), andsilver (Ag) or a laminated metal film including two metals or more.

Like the first embodiment, preferably a laminated film formed of goldlayer/nickel layer from the top, a laminated film formed of goldlayer/palladium layer/nickel layer from the top, a laminated film formedof gold layer/silver layer/palladium layer/nickel layer from the top, asingle layer film formed of a silver layer, a laminated film formed ofsilver layer/nickel layer from the top, a laminated film formed ofsilver layer/palladium layer/nickel layer from the top, or the like canbe used in the state in FIG. 13.

In the above step in FIG. 11B, instead of the nickel layer 21 b, anyplating metal layer may be formed so as to obtain a desired barriermetal layer.

The concave portion 30 a that the upper surface side is opened is formedin the first interlayer insulating layer 30, and the connection pad P isburied in the bottom side of the concave portion 30 a. By this matter,the connection pad P is exposed form the first interlayer insulatinglayer 30 in a state that the upper surface of the connection pad P isarranged under the upper surface of the first interlayer insulatinglayer 30.

The concave level difference portion C whose height is lower than otherupper surfaces of the first interlayer insulating layer 30 is formedlike a ring shape in the first interlayer insulating layer 30 around theupper outer periphery part of the concave portion 30 a.

In this way, in the third embodiment as well, the concave leveldifference portion C is formed in the first interlayer insulating layer30 around the outer periphery part of the connection pad P.

Further, like the first embodiment, the two-layer build-up wiring layer(the second and third wiring layers 22, 24, the first and secondinterlayer insulating layers 30, 32, and the protection insulating layer34) connected to the connection pad P is formed to the lower surfaceside of the first interlayer insulating layer 30.

Like a wiring substrate 3 a depicted in FIG. 14, the connection pad Pmay be formed of the second copper layer 21 c by removing the nickellayer 21 b (barrier metal layer) from the connection pad P of the wiringsubstrate 3 in FIG. 13. In this mode, like FIG. 10 of the secondembodiment, the antioxidant (OSP) may be formed on the exposed secondcopper layer 21 c.

The wiring substrates 3, 3 a of the third embodiment are manufactured asthe coreless substrate which does not have a core substrate whosethickness is thick, and these wiring substrates can also be used as amounting substrate on which a high-performance semiconductor chip ismounted.

Then, as depicted in FIG. 15, the flux (not shown) is coated on theconnection pad P of the wiring substrate 3 in FIG. 13, and then thesolder material 26 such as the solder paste, or the like is coated.Then, the solder bumps 42 of the semiconductor chip 40 are arranged onthe solder materials 26 on the connection pads P of the wiring substrate3.

Then, as depicted in FIG. 16, the semiconductor chip 40 is flip-chipconnected to the connection pads P of the wiring substrate 3 byperforming the reflow heating. An underfill resin may be filled in aclearance between the lower side of the semiconductor chip 40 and theupper surface of the wiring substrate 3.

Then, before or after the semiconductor chip 40 is mounted, the externalconnection terminal 28 is provided by mounting the solder ball on theconnection parts of the third wiring layers 24, or the like.

In the wiring substrate 3 of the third embodiment, the connection pad Pis arranged to the bottom side of the concave portion 30 a of the firstinterlayer insulating layer 30, and also the concave level differenceportion C is formed in the first interlayer insulating layer 30 aroundthe outer periphery part of the concave portion 30 a.

As a result, when the semiconductor chip 40 is flip-chip connected, thesolder is dammed up with the concave portion 30 a of the firstinterlayer insulating layer 30 and the concave level difference portionC. Therefore, it can be prevented that the extra solder flows to theadjacent connection pad P to cause an electric short-circuit.

Also, the concave portion 30 a and the concave level difference portionC are formed in the first interlayer insulating layer 30 over and aroundthe connection pads P. Therefore, the images of the fiducial marks canbe clearly recognized. By this matter, the semiconductor chip can bealigned with the wiring substrate and be mounted with high precision.

Otherwise, like FIG. 6 of the first embodiment, the semiconductor chip40 may be flip-chip connected to the connection portions of the wiringlayer 24, and then the external connection terminals 28 may be providedon the connection pads P.

All examples and conditional language recited herein are intended forpedagogical purpose to aid the reader in understanding the invention andthe concepts contributed by the inventor to furthering the art, and areto be construed as being without limitation to such specifically recitedexamples and conditions, nor does the organization of such examples inthe specification relates to a showing of the superiority andinteriority of the invention. Although the embodiments of the presentinvention have been described in detail, it should be understood thatthe various changes, substitutions, and alterations could be made heretowithout departing from the spirit and scope of the invention.

What is claimed is:
 1. A wiring substrate, comprising: an insulatinglayer; a connection pad buried in the insulating layer in a state thatan upper surface of the connection pad is exposed from an upper surfaceof the insulating layer and a lower surface and at least a part of aside surface of the connection pad contact the insulating layer; and aconcave level difference portion formed in the insulating layer aroundan outer periphery part of the connection pad, wherein the upper surfaceof the connection pad and the upper surface of the insulating layer arearranged at a same height, wherein the connection pad has two layersstructure in which an upper layer part is formed on a lower layer part,and an outer peripheral edge of the lower layer part retrogresses towarda center of the connection pad from an outer peripheral edge of theupper layer part, and wherein the upper layer part of the connection padand the concave level difference portion have the same height, and asolder is formed on the connection pad and in a whole of the concavelevel difference portion.
 2. A wiring substrate according to claim 1,wherein the upper layer part and the lower layer part of the connectionpad are formed of a different metal layer.
 3. A wiring substrateaccording to claim 1, wherein the upper layer part and the lower layerpart of the connection pad are formed of the same metal layer.
 4. Awiring substrate according to claim 1, wherein the upper layer part ofthe connection pad includes at least a metal layer selected from a groupconsisting of a gold layer, palladium layer, nickel layer, copper layer,or silver layer.
 5. A wiring substrate according to claim 1, wherein,the concave level difference portion is formed from the upper surface ofthe insulating layer to a position corresponding to a lower surface ofthe upper layer part of the connection pad.
 6. A wiring substrateaccording to claim 1, wherein an n-layer (n is an integer of 1 or more)wiring layer connected to the connection pad is formed to a lower sideof the insulating layer.
 7. A wiring substrate, comprising: aninsulating layer; a connection pad buried in the insulating layer in astate that an upper surface of the connection pad is exposed from anupper surface of the insulating layer and a lower surface and a whole ofa part of a side surface of the connection pad contact the insulatinglayer; and a concave level difference portion formed in the insulatinglayer around an outer periphery part of the connection pad, wherein theconnection pad is buried in a concave portion of the insulating layer,and the upper surface of the connection pad is arranged to a lower sidethan the upper surface of the insulating layer, and wherein the lowersurface of the connection pad is positioned to a bottom surface of theconcave portion of the insulating layer, and wherein the concave leveldifference portion is located in an upper outer periphery part of theconcave portion, and the concave level difference portion is located ata position above an upper face of the connection pad.
 8. A wiringsubstrate according to claim 7, wherein the connection pad includes alower layer part and an upper layer part formed on the lower layer part,and wherein the upper layer part and the lower layer part of theconnection pad are formed of a different metal layer.
 9. A wiringsubstrate according to claim 8, wherein the upper layer part of theconnection pad includes at least a metal layer selected from a groupconsisting of a gold layer, palladium layer, nickel layer, copper layer,or silver layer.
 10. A wiring substrate according to claim 7, wherein ann-layer (n is an integer of 1 or more) wiring layer connected to theconnection pad is formed to a lower side of the insulating layer.
 11. Awiring substrate according to claim 7, wherein the connection pad isformed of a single metal layer.
 12. A wiring substrate, comprising: aninsulating layer; a connection pad buried in a concave portion providedin an upper surface of the insulating layer in a state that an uppersurface of the connection pad is exposed from an upper surface of theinsulating layer and a lower surface and at least a part of a sidesurface of the connection pad contact the insulating layer, wherein alower surface of the connection pad is positioned to a bottom surface ofthe concave portion; a via hole formed in the insulating layer under theconnection pad, the via hole exposing the lower surface of theconnection pad, wherein the via hole has a truncated cone shape in whicha diameter of the via hole located to the connection pad side is smallerthan a diameter of the via hole located to a lower surface side of theinsulating layer; a wiring layer formed on a lower surface of theinsulating layer, and connected to the connection pad through a viaformed in the via hole; a concave level difference portion formed in theinsulating layer around an outer periphery part of the connection pad,wherein the connection pad includes a lower layer part and an upperlayer part, and an outer peripheral edge of the lower layer partretrogresses toward a center of the connection pad from an outerperipheral edge of the upper layer part, and wherein the upper layerpart of the connection pad and the concave level difference portion havethe same height, and a solder is formed on the connection pad and in awhole of the concave level difference portion.
 13. A wiring substrateaccording to claim 12, wherein the upper layer part and the lower layerpart of the connection pad are formed of a different metal layer.
 14. Awiring substrate according to claim 12, wherein the upper layer part andthe lower layer part of the connection pad are formed of the same metallayer.
 15. A wiring substrate according to claim 12, wherein the upperlayer part of the connection pad includes at least a metal layerselected from a group consisting of a gold layer, palladium layer,nickel layer, copper layer, or silver layer.
 16. A wiring substrateaccording to claim 12, wherein a surface treatment layer is formed onthe connection pad.
 17. A wiring substrate according to claim 12,wherein the concave level difference portion is formed from the uppersurface of the insulating layer to a position corresponding to a lowersurface of the upper layer part of the connection pad.
 18. A wiringsubstrate according to claim 12, wherein an n-layer (n is an integer of1 or more) wiring layer connected to the connection pad is formed to alower side of the insulating layer.